Snapdragon 8 Elite SM8750-3-AB: The ultimate chip for foldables and ultra-thin phones

  • The Snapdragon 8 Elite SM8750-3-AB is a variant optimized for ultra-thin, foldable phones, with lower power consumption and heat generation.
  • It incorporates a 7-core Oryon CPU and Adreno 830 GPU for premium performance and AI, without losing energy efficiency.
  • Ideal for manufacturers looking for thin and light devices without sacrificing power and advanced features, such as cameras up to 320 MP and 5G/Wi-Fi 7 connectivity.

Snapdragon 8 Elite SM8750-3-AB foldable chip

Qualcomm continues to revolutionize the mobile processor market with the presentation of the variant Snapdragon 8 Elite SM8750-3-AB, a chipset that marks a before and after for foldable and ultra-thin smartphonesThis version differs from the standard model in its search for a balance between power, efficiency y thermal management, responding directly to the needs of new flagship devices that prioritize a lightweight design without losing premium capabilities.

The growing demand for flexible terminals and ultra-slim form factor forces manufacturers to look for solutions that are not only compact, but also allow optimise the performance without compromising autonomy or user experience. Qualcomm has listened to these needs and has implemented specific innovations for this segment, highlighting the SM8750-3-AB as a benchmark in the integration of advanced technology in increasingly smaller formats.

Snapdragon 8 Elite SM8750-3-AB: A design built for the challenges of foldables

Snapdragon 8 Elite SM8750-3-AB foldable chip

El Snapdragon 8 Elite SM8750-3-AB was born from the need to adapt the maximum technology to the limited space of foldable and ultra-thin devices. Unlike the original variant, this chipset reduced your CPU settings going from 8 to 7 cores, losing one of its high-performance cores (Performance), which has direct repercussions on both the heat generation and the energy.

The cut is not arbitrary: the foldable and ultra-light mobile phones have significant heat dissipation challenges due to limited space for internal cooling systems. By reducing a CPU core, the heat generated decreases significantly, which optimizes thermal management and prevents performance drops due to overheating, a recurring concern in the more compact models.

This adjustment, far from implying a significant loss of power for the average user, allows maintaining high standards in everyday tasks, games and applications, with a difference that is usually less than 10% in intensive tests, and much smaller in real-world usage scenarios. In addition, it translates into greater autonomy and less wear of the battery, key to the experience with latest generation terminals.

Advanced technical specifications: Performance, efficiency and artificial intelligence

Snapdragon 8 Elite SM8750-3-AB foldable chip

  • 3 nanometer manufacturing process (TSMC's N3E): It allows for a higher density of transistors, lower consumption and much more effective thermal dissipation.
  • 2nd generation custom Oryon CPU: Composed by two Prime cores a 4,32 GHz y Five Performance Cores a 3,53 GHzThis hepta-core design is optimized for intensive tasks and multitasking without compromising efficiency.
  • Next-generation Adreno 830 GPU: Able to render games in HDR, real-time ray tracing y advanced AI features, maintaining compatibility with the most demanding games and applications.
  • NPU Hexagon y Qualcomm AI Engine: Substantial improvements in artificial intelligence (AI) processing for photos, video, real-time translation, and digital assistants.
  • Support for QHD+ displays up to 240Hz and 4K at 60Hz: Fluid, high-resolution visual experiences for select devices.
  • Premium Image Support: Compatibility with Dolby Vision, HDR10, HDR10 + and support for camera sensors up to 320 MP, allowing recording in latest generation HDR formats.
  • Snapdragon X80 5G Modem: With multi-gigabit speeds, support for mmWave y sub-6GHz, and AI-enhanced positioning technology.
  • FastConnect 7900: For high-end wireless connectivity, Wi-Fi 7, Bluetooth 6.0, Ultra Wide Band (UWB), and precise distance measurement via WiFi.
  • snapdragon sound and XPAN

Thanks to these capabilities, even with one less core, the Snapdragon 8 Elite SM8750-3-AB is positioned as the benchmark choice for ultra-thin flagship smartphones, allowing manufacturers to bring cutting-edge hardware to extremely compact designs.

Snapdragon 8 Elite SM8750-3-AB foldable chip

Key differences from the standard Snapdragon 8 Elite and why it exists

Snapdragon 8 Elite SM8750-3-AB in smartphones

El SM8750-3-AB It differs from its standard version (SM8750-AB) not only in the reduction of cores, but also in its strategic orientation. The fundamental reason is optimize energy efficiency and minimize heat, without losing the high-end features so appreciated in the Elite family.

Although the performance difference in synthetic tests can reach between 7 and 14% in multi-core tasks, the real-life test They demonstrate that the impact on the user experience is barely perceptible for most consumers. In single-core or AI tasks, the difference is marginal. It's a perfect solution for devices where design and portability are a priority, without sacrificing power for demanding tasks, gaming, and advanced video or photo editing.

In addition, this release allows manufacturers reduce production costs Using binning techniques, by leveraging chips that don't fully meet the standards of the 100-core model but perform optimally under this new configuration. Thus, more devices can access a high-level platform, with direct benefits in autonomy, price and longevity.

Presence in foldable and ultra-thin smartphones: The models that set the trend

Qualcomm Snapdragon 8 Elite SM8750-3-AB

The arrival of Snapdragon 8 Elite SM8750-3-AB is being especially relevant for the latest generations of foldable phones from brands like Samsung, Oppo, Xiaomi, Motorola, Huawei and Google, which seek to differentiate themselves in a market where the flexibility and thickness of the device make the difference.

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Series like the Samsung Galaxy Z Fold7 y Z-Flip7 are among the first to adopt this optimized variant, ensuring a premium experience In devices that require maximum lightness and minimal heat generation. Other notable models, such as the OPPO Find N5, take advantage of this version to offer even slimmer profiles than ever before without sacrificing battery life or graphics power.

Although some rumors suggest that certain models could opt for alternatives such as the Exynos chip, the truth is that the Snapdragon 8 Elite SM8750-3-AB is consolidating its position as the benchmark processor for those manufacturers that prioritize advanced design along with outstanding connectivity and performance.

Technical advantages and user experience: Is it worth it?

Independent benchmarks and lab studies have shown that for most users, the transition from 8 to 7 cores does not result in a significant loss of fluidity. It is very difficult to perceive differences in daily applications and the impact on demanding games is offset by improved heat dissipation and greater stability, avoiding performance drops after long sessions.

For those seeking the absolute maximum performance, the standard Snapdragon 8 Elite is slightly superior, but the trade-off of the SM8750-3-AB It is widely justified in formats where ergonomics and autonomy outweigh the cost of gaining a couple of seconds in specific renderings.

Advanced AI integration enables new functionalities, from automatic voice translation y improved image processing to much faster and more accurate virtual assistants. In addition, the next-generation Wi-Fi 7 and 5G connectivity prepares terminals for the most advanced services and the future of the mobile cloud.

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